Advantech MIC-770

Modular fanless IPC with 12th/13th Gen Intel® Core™ i CPU Socket (LGA 1700)

• Intel® 12th/13th Gen Core™ i CPU socket-type (LGA1700) with Intel® R680E/H610E chipset

• Wide operating temperature (-20 ~ 60 °C)

• 9 ~ 36 VDC input power range

• VGA and HDMI output

• 2 x GigaLAN, 2 x USB 3.2 (Gen2) and 6 x USB 3.2 (Gen1); 2 x RS-232/422/485 and 4 x RS232 serial ports (Optional)

• 1 x 2.5″ HDD/SSD, 1 x mSATA, and 1 x NVMe M.2

• IP40 dust proof for deployment in harsh environment

• Supports FlexIO and iDoor technology, flexible configure additional HDMI, DP, DVI, COM port, DIO, Remote switch IO

• Supports Advantech i-Modules; Supports Advantech SUSIAPI and embedded software APIs

• Supports Intel® vPro™/AMT and TPM technologies

• Supports Advantech iBMC 1.2 remote out-of-band power management solution on WISE-DeviceOn

Modular fanless IPC with 10th Gen Intel® Xeon®/Core™ i CPU Socket (LGA 1200)

• Intel® 10th Gen Xeon®/Core™ i CPU socket-type (LGA1200) with Intel® W480E/H420E chipset

• Wide operating temperature (-10 ~ 60 °C)

• 9 ~ 36 VDC input power range

• VGA and HDMI output

• 2 x GigaLAN, 2 x USB 3.2 (Gen2) and 6 x USB 3.2 (Gen1)

• 2 x RS-232/422/485 and 4 x RS232 serial ports (Optional)

• 1 x 2.5″ HDD/SSD, and 1 x mSATA

• Supports Advantech i-Modules, FlexIO and iDoor technology, flexible configure additional HDMI, DVI, Comport, DIO, Remote switch IO

• Microsoft Azure PnP, AWS IoT Greengrass, Ubuntu Certified

• RED Compliance